Mechanical Engineer (Semiconductor IC, Entry Level)
Triton AI Pte Ltd, Singapore

Roles amp; Responsibilities:

• Perform mechanical amp; thermo-mechanical analysis and characterization of advanced IC packages
• Build up new mechanical amp; thermo-mechanical capabilities with latest simulation and characterization technologies
• Design advanced packages for customers to meet their reliability and manufacturability specifications amp; needs
• Assess the feasibility of new packaging assembly and process technologies with respect to mechanical and reliability performance
• Conduct IC packaging technology development together with other teams
• Carry out mechanical and reliability test and correlate with mechanical amp; thermo-mechanical simulation for validation

Requirements:

• Bachelor in Mechanical Engineering or related
• Solid knowledge on FEM amp; mechanics of material
• Mechanical modeling experience for IC package’s stress amp; warpage, board-level reliability such as drop test amp; TCOB using simulation software such as Ansys or Abaqus is a must
• Thermo-mechanical modeling experience for IC assembly molding process, die stress/shifting in fan-out WLP, and wire bonding using simulation software such as Ansys amp; Abaqus is preferable
• Mechanical and reliability test experience such as drop test, TCOB test, warpage measurement, bending test, material strength test is highly desirable
• Keen for Ramp;D activities in IC packaging technology development, package’s mechanical amp; thermo-mechanical analysis/design/optimization/characterization
• No experience are required as training provided.

Interested candidates can forward their CVs in MS Word format to

Reg No. R1549345

Triton AI Pte Ltd

License no. 21C0661

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